{
	"OtherCopyrightsInfo": null,
	"PatentsInfo": {
		"list": [
			{
				"createDate": "2021-01-29",
				"createNum": "2020207207460",
				"patentName": "防静电供电装置",
				"type": "实用新型"
			},
			{
				"createDate": "2020-09-18",
				"createNum": "CN201922423439.6",
				"patentName": "自动上料装置",
				"type": "实用新型"
			},
			{
				"createDate": "2020-01-31",
				"createNum": "CN201930284531.1",
				"patentName": "陶瓷基板旋转上料机构",
				"type": "外观专利"
			},
			{
				"createDate": "2019-11-22",
				"createNum": "CN201822258109.1",
				"patentName": "回流焊自动上料机构",
				"type": "实用新型"
			},
			{
				"createDate": "2019-11-22",
				"createNum": "CN201822258110.4",
				"patentName": "自动上料装置",
				"type": "实用新型"
			},
			{
				"createDate": "2019-09-20",
				"createNum": "CN201830771407.3",
				"patentName": "陶瓷基板旋转上料机构",
				"type": "外观专利"
			},
			{
				"createDate": "2019-08-27",
				"createNum": "CN201822272640.4",
				"patentName": "半导体回流焊自动下料机构",
				"type": "实用新型"
			},
			{
				"createDate": "2019-08-02",
				"createNum": "CN201822272615.6",
				"patentName": "陶瓷基板转动上料机构",
				"type": "实用新型"
			},
			{
				"createDate": "2019-05-24",
				"createNum": "CN201830771387.X",
				"patentName": "锡膏印刷上料机",
				"type": "外观专利"
			},
			{
				"createDate": "2018-05-08",
				"createNum": "CN201721506943.7",
				"patentName": "一种键合设备",
				"type": "实用新型"
			},
			{
				"createDate": "2018-02-23",
				"createNum": "CN201720748844.3",
				"patentName": "一种上下料用工装及打印、切筋生产线",
				"type": "实用新型"
			},
			{
				"createDate": "2016-01-20",
				"createNum": "CN201210499366.9",
				"patentName": "封装结构及封装工艺",
				"type": "发明专利"
			},
			{
				"createDate": "2015-08-19",
				"createNum": "CN201210325436.9",
				"patentName": "半导体塑封上料治具及上料方法",
				"type": "发明专利"
			},
			{
				"createDate": "2015-04-29",
				"createNum": "CN201110341987.X",
				"patentName": "一种垂直传感器的封装方法",
				"type": "发明专利"
			},
			{
				"createDate": "2015-04-22",
				"createNum": "CN201210466477.X",
				"patentName": "保证全包封产品塑封体厚度的夹具、装置及方法",
				"type": "发明专利"
			},
			{
				"createDate": "2015-04-15",
				"createNum": "CN201420805498.4",
				"patentName": "MEMS压力传感器",
				"type": "实用新型"
			},
			{
				"createDate": "2015-02-18",
				"createNum": "CN201420625581.3",
				"patentName": "电镀装片夹具",
				"type": "实用新型"
			},
			{
				"createDate": "2015-01-21",
				"createNum": "CN201210294332.6",
				"patentName": "芯片封装系统、方法、注入装置及冲压与注入联动装置",
				"type": "发明专利"
			},
			{
				"createDate": "2014-12-31",
				"createNum": "CN201210297097.8",
				"patentName": "激光打标耐压测试一体机和激光打标耐压测试方法",
				"type": "发明专利"
			},
			{
				"createDate": "2013-05-01",
				"createNum": "CN201220641781.9",
				"patentName": "封装切割结构以及封装结构",
				"type": "实用新型"
			},
			{
				"createDate": "2013-03-20",
				"createNum": "CN201210499366.9",
				"patentName": "封装结构及封装工艺",
				"type": "发明专利"
			},
			{
				"createDate": "2013-03-06",
				"createNum": "CN201220460987.1",
				"patentName": "MEMS封装结构",
				"type": "实用新型"
			},
			{
				"createDate": "2013-02-27",
				"createNum": "CN201220456999.7",
				"patentName": "IC塑封体耐压测试夹具",
				"type": "实用新型"
			},
			{
				"createDate": "2013-02-13",
				"createNum": "CN201210466477.X",
				"patentName": "保证全包封产品塑封体厚度的夹具、装置及方法",
				"type": "发明专利"
			},
			{
				"createDate": "2013-01-02",
				"createNum": "CN201110341987.X",
				"patentName": "一种垂直传感器的封装方法",
				"type": "发明专利"
			},
			{
				"createDate": "2012-12-19",
				"createNum": "CN201210325436.9",
				"patentName": "半导体塑封上料治具及上料方法",
				"type": "发明专利"
			},
			{
				"createDate": "2012-12-05",
				"createNum": "CN201210294332.6",
				"patentName": "芯片封装系统、方法、注入装置及冲压与注入联动装置",
				"type": "发明专利"
			},
			{
				"createDate": "2012-11-28",
				"createNum": "CN201210297097.8",
				"patentName": "激光打标耐压测试一体机和激光打标耐压测试方法",
				"type": "发明专利"
			},
			{
				"createDate": "2012-07-04",
				"createNum": "CN201120428218.9",
				"patentName": "一种垂直传感器的封装结构",
				"type": "实用新型"
			}
		],
		"total": 29
	},
	"ProfileTags": [],
	"SoftwareCopyrightsInfo": null,
	"TrademarksInfo": {
		"list": [
			{
				"name": "图形",
				"status": "商标已注册",
				"type": "42-网站服务"
			},
			{
				"name": "图形",
				"status": "商标已注册",
				"type": "09-科学仪器"
			}
		],
		"total": 2
	},
	"base": {
		"allows": [
			{
				"docName": "企业投资项目核准",
				"docNo": "2018-510121-39-03-260634",
				"endDate": "2018-04-26 00:00:00"
			}
		],
		"base": {
			"OtherCopyrightsInfo": 0,
			"PatentsInfo": 29,
			"ProfileTags": [],
			"SoftwareCopyrightsInfo": 0,
			"TrademarksInfo": 2,
			"allows": 1,
			"authority": "金堂县市场监督管理局",
			"branches": 0,
			"businessDateFrom": "2015-06-04 00:00:00",
			"businessDateTo": null,
			"businessScope": "集成电路、半导体分立器件、功率模块等半导体产品的设计、制造、销售及相关技术转让；相关的原材料、机械设备的销售；货物进出口和技术进出口。(依法需批准的项目，经相关部门批准后方可开展经营活动)。",
			"capital": "65000.000000万人民币",
			"changes": 38,
			"companyAddress": "四川省成都市金堂县淮口镇士芯路9号1栋1-3楼（成都—阿坝工业集中发展区内）",
			"companyCode": "510121000064184",
			"companyName": "成都集佳科技有限公司",
			"companyStatus": "存续（在营、开业、在册）",
			"companyType": "有限责任公司（自然人投资或控股的法人独资）",
			"contactInfo": {
				"email": "497837510@qq.com",
				"phoneNumber": "028-84925100",
				"website": [
					{
						"name": "成都集佳科技有限公司",
						"url": "www.perfect-cd.com"
					}
				]
			},
			"creditNo": "9151012134303590X1",
			"employees": 3,
			"establishDate": "2015-06-02 00:00:00",
			"exceptions": 0,
			"industry": {
				"industryL1Name": "制造业",
				"industryL2Name": "电气机械和器材制造业"
			},
			"isOnStock": "0",
			"issueDate": "2021-11-08 00:00:00",
			"keyNo": "3cf7a25c31b59600bf3cfdfd76293274",
			"legalPerson": "范伟宏",
			"liquidation": null,
			"mPledges": 1,
			"orgCode": "34303590X",
			"originalName": 0,
			"partners": 1,
			"pledges": 0,
			"province": "SC",
			"punishes": 0,
			"revokeDate": null,
			"shiXinItems": 0,
			"spotChecks": 0,
			"stockNumber": null,
			"stockType": null,
			"taxCreditltems": 2,
			"updatedDate": null,
			"zhiXingItems": 0
		},
		"branches": [],
		"changes": [
			{
				"changeAfter": "4000",
				"changeBefore": "成都士兰半导体制造有限公司;",
				"changeDate": "2015-09-25 00:00:00",
				"changeField": "出资额变更"
			},
			{
				"changeAfter": "15000",
				"changeBefore": "成都士兰半导体制造有限公司;",
				"changeDate": "2017-06-21 00:00:00",
				"changeField": "股东或股份发起人改变姓名或名称变更"
			},
			{
				"changeAfter": "40000.000000万人民币",
				"changeBefore": "31000万人民币",
				"changeDate": "2020-11-03 00:00:00",
				"changeField": "注册资本变更"
			},
			{
				"changeAfter": "成都士兰半导体制造有限公司,货币;",
				"changeBefore": "成都士兰半导体制造有限公司;",
				"changeDate": "2015-09-25 00:00:00",
				"changeField": "出资方式变更"
			},
			{
				"changeAfter": "9000",
				"changeBefore": "4000",
				"changeDate": "2015-12-24 00:00:00",
				"changeField": "注册资本(金)变更"
			},
			{
				"changeAfter": "成都士兰半导体制造有限公司,实物,货币;",
				"changeBefore": "成都士兰半导体制造有限公司;",
				"changeDate": "2015-12-24 00:00:00",
				"changeField": "出资方式变更"
			},
			{
				"changeAfter": "18000",
				"changeBefore": "成都士兰半导体制造有限公司;",
				"changeDate": "2018-10-11 00:00:00",
				"changeField": "出资额变更"
			},
			{
				"changeAfter": "成都士兰半导体制造有限公司 出资 40000万人民币;",
				"changeBefore": "成都士兰半导体制造有限公司 出资 31000万人民币;",
				"changeDate": "2020-11-03 00:00:00",
				"changeField": "投资人(股权)变更"
			},
			{
				"changeAfter": "18000",
				"changeBefore": "成都士兰半导体制造有限公司;",
				"changeDate": "2018-10-11 00:00:00",
				"changeField": "股东或股份发起人改变姓名或名称变更"
			},
			{
				"changeAfter": "/",
				"changeBefore": "/",
				"changeDate": "2017-03-21 00:00:00",
				"changeField": "换发证照"
			},
			{
				"changeAfter": "18000",
				"changeBefore": "15000",
				"changeDate": "2018-10-11 00:00:00",
				"changeField": "注册资本(金)变更"
			},
			{
				"changeAfter": "成都士兰半导体制造有限公司 出资 31000万人民币;",
				"changeBefore": "成都士兰半导体制造有限公司 出资 21000万人民币;",
				"changeDate": "2020-08-26 00:00:00",
				"changeField": "投资人(股权)变更"
			},
			{
				"changeAfter": "成都士兰半导体制造有限公司,实物,货币;",
				"changeBefore": "成都士兰半导体制造有限公司;",
				"changeDate": "2017-06-21 00:00:00",
				"changeField": "股东或股份发起人改变姓名或名称变更"
			},
			{
				"changeAfter": "15000",
				"changeBefore": "成都士兰半导体制造有限公司;",
				"changeDate": "2017-06-21 00:00:00",
				"changeField": "出资额变更"
			},
			{
				"changeAfter": "成都士兰半导体制造有限公司 出资 21000万人民币;",
				"changeBefore": "成都士兰半导体制造有限公司 出资 18000万人民币;",
				"changeDate": "2020-06-03 00:00:00",
				"changeField": "出资情况"
			},
			{
				"changeAfter": "4000",
				"changeBefore": "500",
				"changeDate": "2015-09-25 00:00:00",
				"changeField": "注册资本(金)变更"
			},
			{
				"changeAfter": "65000.000000万人民币",
				"changeBefore": "52000万人民币",
				"changeDate": "2021-11-08 00:00:00",
				"changeField": "注册资本变更"
			},
			{
				"changeAfter": "9000",
				"changeBefore": "成都士兰半导体制造有限公司;",
				"changeDate": "2015-12-25 00:00:00",
				"changeField": "出资额变更"
			},
			{
				"changeAfter": "21000.000000万人民币",
				"changeBefore": "18000万人民币",
				"changeDate": "2020-06-03 00:00:00",
				"changeField": "注册资本变更"
			},
			{
				"changeAfter": "/",
				"changeBefore": "/",
				"changeDate": "2017-03-21 00:00:00",
				"changeField": "其他事项备案"
			},
			{
				"changeAfter": "15000",
				"changeBefore": "9000",
				"changeDate": "2017-06-21 00:00:00",
				"changeField": "注册资本(金)变更"
			},
			{
				"changeAfter": "9000",
				"changeBefore": "成都士兰半导体制造有限公司;",
				"changeDate": "2015-12-25 00:00:00",
				"changeField": "股东或股份发起人改变姓名或名称变更"
			},
			{
				"changeAfter": "15000",
				"changeBefore": "9000",
				"changeDate": "2017-06-21 00:00:00",
				"changeField": "其他事项备案"
			},
			{
				"changeAfter": "成都士兰半导体制造有限公司 出资 65000万人民币;",
				"changeBefore": "成都士兰半导体制造有限公司 出资 52000万人民币;",
				"changeDate": "2021-11-08 00:00:00",
				"changeField": "投资人(股权)变更"
			},
			{
				"changeAfter": "31000.000000万人民币",
				"changeBefore": "21000万人民币",
				"changeDate": "2020-08-26 00:00:00",
				"changeField": "注册资本变更"
			},
			{
				"changeAfter": "9000",
				"changeBefore": "4000",
				"changeDate": "2015-12-24 00:00:00",
				"changeField": "其他事项备案"
			},
			{
				"changeAfter": "成都士兰半导体制造有限公司,货币;",
				"changeBefore": "成都士兰半导体制造有限公司;",
				"changeDate": "2015-09-25 00:00:00",
				"changeField": "股东或股份发起人改变姓名或名称变更"
			},
			{
				"changeAfter": "4000",
				"changeBefore": "成都士兰半导体制造有限公司;",
				"changeDate": "2015-09-25 00:00:00",
				"changeField": "股东或股份发起人改变姓名或名称变更"
			},
			{
				"changeAfter": "52000.000000万人民币",
				"changeBefore": "40000万人民币",
				"changeDate": "2021-03-30 00:00:00",
				"changeField": "注册资本变更"
			},
			{
				"changeAfter": "21000.000000万人民币",
				"changeBefore": "18000万人民币",
				"changeDate": "2020-06-03 00:00:00",
				"changeField": "注册资本(金)变更"
			},
			{
				"changeAfter": "成都士兰半导体制造有限公司,实物,货币;",
				"changeBefore": "成都士兰半导体制造有限公司;",
				"changeDate": "2015-12-24 00:00:00",
				"changeField": "股东或股份发起人改变姓名或名称变更"
			},
			{
				"changeAfter": "成都士兰半导体制造有限公司 出资 52000万人民币;",
				"changeBefore": "成都士兰半导体制造有限公司 出资 40000万人民币;",
				"changeDate": "2021-03-30 00:00:00",
				"changeField": "投资人(股权)变更"
			},
			{
				"changeAfter": "成都士兰半导体制造有限公司,实物,货币;",
				"changeBefore": "成都士兰半导体制造有限公司;",
				"changeDate": "2017-06-21 00:00:00",
				"changeField": "出资方式变更"
			},
			{
				"changeAfter": "成都士兰半导体制造有限公司 出资 21000万人民币;",
				"changeBefore": "成都士兰半导体制造有限公司 出资 18000万人民币;",
				"changeDate": "2020-06-03 00:00:00",
				"changeField": "投资人(股权)变更"
			},
			{
				"changeAfter": "集成电路、半导体分立器件、功率模块等半导体产品的设计、制造、销售及相关技术转让；相关的原材料、机械设备的销售；货物进出口和技术进出口。(依法需批准的项目,经相关部门批准后方可开展经营活动)。",
				"changeBefore": "集成电路、半导体分立器件、功率模块等半导体产品的设计、制造、销售；货物进出口。(依法需批准的项目,经相关部门批准后方可开展经营活动)。",
				"changeDate": "2017-10-23 00:00:00",
				"changeField": "投资人(股权)变更"
			},
			{
				"changeAfter": "18000",
				"changeBefore": "15000",
				"changeDate": "2018-10-11 00:00:00",
				"changeField": "其他事项备案"
			},
			{
				"changeAfter": "集成电路、半导体分立器件、功率模块等半导体产品的设计、制造、销售及相关技术转让；相关的原材料、机械设备的销售；货物进出口和技术进出口。(依法需批准的项目,经相关部门批准后方可开展经营活动)。",
				"changeBefore": "集成电路、半导体分立器件、功率模块等半导体产品的设计、制造、销售；货物进出口。(依法需批准的项目,经相关部门批准后方可开展经营活动)。",
				"changeDate": "2017-10-23 00:00:00",
				"changeField": "经营范围变更"
			},
			{
				"changeAfter": "4000",
				"changeBefore": "500",
				"changeDate": "2015-09-25 00:00:00",
				"changeField": "其他事项备案"
			}
		],
		"contactInfo": {
			"email": "497837510@qq.com",
			"phoneNumber": "028-84925100",
			"website": [
				{
					"name": "成都集佳科技有限公司",
					"url": "www.perfect-cd.com"
				}
			]
		},
		"employees": [
			{
				"employeeName": "李学敏",
				"position": "总经理"
			},
			{
				"employeeName": "范伟宏",
				"position": "执行董事"
			},
			{
				"employeeName": "陈国华",
				"position": "监事"
			}
		],
		"exceptions": [],
		"industry": {
			"industryL1Name": "制造业",
			"industryL2Name": "电气机械和器材制造业"
		},
		"liquidation": null,
		"mPledges": [
			{
				"debtSecuredAmount": "4000万人民币",
				"publicDate": null,
				"registerDate": "2019-07-17 00:00:00",
				"registerNo": "51012019003620",
				"registerOffice": "四川省成都市金堂县市场和质量监督管理局",
				"status": "有效"
			}
		],
		"originalName": [],
		"partners": [
			{
				"capiDate": null,
				"investName": null,
				"investType": "货币,实物",
				"shoudDate": "2021-03-31 00:00:00,2021-12-31 00:00:00",
				"stockCapital": "65000.0",
				"stockName": "成都士兰半导体制造有限公司",
				"stockPercent": "1.0000",
				"stockRealcapital": null,
				"stockType": "企业法人"
			}
		],
		"pledges": [],
		"punishes": [],
		"shiXinItems": [],
		"spotChecks": [],
		"taxCreditltems": [
			{
				"level": "A",
				"taxPayerName": "成都集佳科技有限公司",
				"taxPayerNo": "9151012134303590X1",
				"year": "2019"
			},
			{
				"level": "A",
				"taxPayerName": "成都集佳科技有限公司",
				"taxPayerNo": "9151012134303590X1",
				"year": "2020"
			}
		],
		"zhiXingItems": []
	}
}