hotime/example/tpt/company/71c70f78fec43981b71fca407213fc90/202202281312.json
2022-02-28 19:37:52 +08:00

570 lines
17 KiB
JSON
Raw Blame History

This file contains ambiguous Unicode characters

This file contains Unicode characters that might be confused with other characters. If you think that this is intentional, you can safely ignore this warning. Use the Escape button to reveal them.

{
"OtherCopyrightsInfo": null,
"PatentsInfo": {
"list": [
{
"createDate": "2021-01-29",
"createNum": "2020207207460",
"patentName": "防静电供电装置",
"type": "实用新型"
},
{
"createDate": "2020-09-18",
"createNum": "CN201922423439.6",
"patentName": "自动上料装置",
"type": "实用新型"
},
{
"createDate": "2020-01-31",
"createNum": "CN201930284531.1",
"patentName": "陶瓷基板旋转上料机构",
"type": "外观专利"
},
{
"createDate": "2019-11-22",
"createNum": "CN201822258109.1",
"patentName": "回流焊自动上料机构",
"type": "实用新型"
},
{
"createDate": "2019-11-22",
"createNum": "CN201822258110.4",
"patentName": "自动上料装置",
"type": "实用新型"
},
{
"createDate": "2019-09-20",
"createNum": "CN201830771407.3",
"patentName": "陶瓷基板旋转上料机构",
"type": "外观专利"
},
{
"createDate": "2019-08-27",
"createNum": "CN201822272640.4",
"patentName": "半导体回流焊自动下料机构",
"type": "实用新型"
},
{
"createDate": "2019-08-02",
"createNum": "CN201822272615.6",
"patentName": "陶瓷基板转动上料机构",
"type": "实用新型"
},
{
"createDate": "2019-05-24",
"createNum": "CN201830771387.X",
"patentName": "锡膏印刷上料机",
"type": "外观专利"
},
{
"createDate": "2018-05-08",
"createNum": "CN201721506943.7",
"patentName": "一种键合设备",
"type": "实用新型"
},
{
"createDate": "2018-02-23",
"createNum": "CN201720748844.3",
"patentName": "一种上下料用工装及打印、切筋生产线",
"type": "实用新型"
},
{
"createDate": "2016-01-20",
"createNum": "CN201210499366.9",
"patentName": "封装结构及封装工艺",
"type": "发明专利"
},
{
"createDate": "2015-08-19",
"createNum": "CN201210325436.9",
"patentName": "半导体塑封上料治具及上料方法",
"type": "发明专利"
},
{
"createDate": "2015-04-29",
"createNum": "CN201110341987.X",
"patentName": "一种垂直传感器的封装方法",
"type": "发明专利"
},
{
"createDate": "2015-04-22",
"createNum": "CN201210466477.X",
"patentName": "保证全包封产品塑封体厚度的夹具、装置及方法",
"type": "发明专利"
},
{
"createDate": "2015-04-15",
"createNum": "CN201420805498.4",
"patentName": "MEMS压力传感器",
"type": "实用新型"
},
{
"createDate": "2015-02-18",
"createNum": "CN201420625581.3",
"patentName": "电镀装片夹具",
"type": "实用新型"
},
{
"createDate": "2015-01-21",
"createNum": "CN201210294332.6",
"patentName": "芯片封装系统、方法、注入装置及冲压与注入联动装置",
"type": "发明专利"
},
{
"createDate": "2014-12-31",
"createNum": "CN201210297097.8",
"patentName": "激光打标耐压测试一体机和激光打标耐压测试方法",
"type": "发明专利"
},
{
"createDate": "2013-05-01",
"createNum": "CN201220641781.9",
"patentName": "封装切割结构以及封装结构",
"type": "实用新型"
},
{
"createDate": "2013-03-20",
"createNum": "CN201210499366.9",
"patentName": "封装结构及封装工艺",
"type": "发明专利"
},
{
"createDate": "2013-03-06",
"createNum": "CN201220460987.1",
"patentName": "MEMS封装结构",
"type": "实用新型"
},
{
"createDate": "2013-02-27",
"createNum": "CN201220456999.7",
"patentName": "IC塑封体耐压测试夹具",
"type": "实用新型"
},
{
"createDate": "2013-02-13",
"createNum": "CN201210466477.X",
"patentName": "保证全包封产品塑封体厚度的夹具、装置及方法",
"type": "发明专利"
},
{
"createDate": "2013-01-02",
"createNum": "CN201110341987.X",
"patentName": "一种垂直传感器的封装方法",
"type": "发明专利"
},
{
"createDate": "2012-12-19",
"createNum": "CN201210325436.9",
"patentName": "半导体塑封上料治具及上料方法",
"type": "发明专利"
},
{
"createDate": "2012-12-05",
"createNum": "CN201210294332.6",
"patentName": "芯片封装系统、方法、注入装置及冲压与注入联动装置",
"type": "发明专利"
},
{
"createDate": "2012-11-28",
"createNum": "CN201210297097.8",
"patentName": "激光打标耐压测试一体机和激光打标耐压测试方法",
"type": "发明专利"
},
{
"createDate": "2012-07-04",
"createNum": "CN201120428218.9",
"patentName": "一种垂直传感器的封装结构",
"type": "实用新型"
}
],
"total": 29
},
"ProfileTags": [],
"SoftwareCopyrightsInfo": null,
"TrademarksInfo": {
"list": [
{
"name": "图形",
"status": "商标已注册",
"type": "42-网站服务"
},
{
"name": "图形",
"status": "商标已注册",
"type": "09-科学仪器"
}
],
"total": 2
},
"base": {
"allows": [
{
"docName": "企业投资项目核准",
"docNo": "2018-510121-39-03-260634",
"endDate": "2018-04-26 00:00:00"
}
],
"base": {
"OtherCopyrightsInfo": 0,
"PatentsInfo": 29,
"ProfileTags": [],
"SoftwareCopyrightsInfo": 0,
"TrademarksInfo": 2,
"allows": 1,
"authority": "金堂县市场监督管理局",
"branches": 0,
"businessDateFrom": "2015-06-04 00:00:00",
"businessDateTo": null,
"businessScope": "集成电路、半导体分立器件、功率模块等半导体产品的设计、制造、销售及相关技术转让;相关的原材料、机械设备的销售;货物进出口和技术进出口。(依法需批准的项目,经相关部门批准后方可开展经营活动)。",
"capital": "65000.000000万人民币",
"changes": 38,
"companyAddress": "四川省成都市金堂县淮口镇士芯路9号1栋1-3楼成都—阿坝工业集中发展区内",
"companyCode": "510121000064184",
"companyName": "成都集佳科技有限公司",
"companyStatus": "存续(在营、开业、在册)",
"companyType": "有限责任公司(自然人投资或控股的法人独资)",
"contactInfo": {
"email": "497837510@qq.com",
"phoneNumber": "028-84925100",
"website": [
{
"name": "成都集佳科技有限公司",
"url": "www.perfect-cd.com"
}
]
},
"creditNo": "9151012134303590X1",
"employees": 3,
"establishDate": "2015-06-02 00:00:00",
"exceptions": 0,
"industry": {
"industryL1Name": "制造业",
"industryL2Name": "电气机械和器材制造业"
},
"isOnStock": "0",
"issueDate": "2021-11-08 00:00:00",
"keyNo": "3cf7a25c31b59600bf3cfdfd76293274",
"legalPerson": "范伟宏",
"liquidation": null,
"mPledges": 1,
"orgCode": "34303590X",
"originalName": 0,
"partners": 1,
"pledges": 0,
"province": "SC",
"punishes": 0,
"revokeDate": null,
"shiXinItems": 0,
"spotChecks": 0,
"stockNumber": null,
"stockType": null,
"taxCreditltems": 2,
"updatedDate": null,
"zhiXingItems": 0
},
"branches": [],
"changes": [
{
"changeAfter": "4000",
"changeBefore": "成都士兰半导体制造有限公司;",
"changeDate": "2015-09-25 00:00:00",
"changeField": "出资额变更"
},
{
"changeAfter": "15000",
"changeBefore": "成都士兰半导体制造有限公司;",
"changeDate": "2017-06-21 00:00:00",
"changeField": "股东或股份发起人改变姓名或名称变更"
},
{
"changeAfter": "40000.000000万人民币",
"changeBefore": "31000万人民币",
"changeDate": "2020-11-03 00:00:00",
"changeField": "注册资本变更"
},
{
"changeAfter": "成都士兰半导体制造有限公司,货币;",
"changeBefore": "成都士兰半导体制造有限公司;",
"changeDate": "2015-09-25 00:00:00",
"changeField": "出资方式变更"
},
{
"changeAfter": "9000",
"changeBefore": "4000",
"changeDate": "2015-12-24 00:00:00",
"changeField": "注册资本(金)变更"
},
{
"changeAfter": "成都士兰半导体制造有限公司,实物,货币;",
"changeBefore": "成都士兰半导体制造有限公司;",
"changeDate": "2015-12-24 00:00:00",
"changeField": "出资方式变更"
},
{
"changeAfter": "18000",
"changeBefore": "成都士兰半导体制造有限公司;",
"changeDate": "2018-10-11 00:00:00",
"changeField": "出资额变更"
},
{
"changeAfter": "成都士兰半导体制造有限公司 出资 40000万人民币;",
"changeBefore": "成都士兰半导体制造有限公司 出资 31000万人民币;",
"changeDate": "2020-11-03 00:00:00",
"changeField": "投资人(股权)变更"
},
{
"changeAfter": "18000",
"changeBefore": "成都士兰半导体制造有限公司;",
"changeDate": "2018-10-11 00:00:00",
"changeField": "股东或股份发起人改变姓名或名称变更"
},
{
"changeAfter": "/",
"changeBefore": "/",
"changeDate": "2017-03-21 00:00:00",
"changeField": "换发证照"
},
{
"changeAfter": "18000",
"changeBefore": "15000",
"changeDate": "2018-10-11 00:00:00",
"changeField": "注册资本(金)变更"
},
{
"changeAfter": "成都士兰半导体制造有限公司 出资 31000万人民币;",
"changeBefore": "成都士兰半导体制造有限公司 出资 21000万人民币;",
"changeDate": "2020-08-26 00:00:00",
"changeField": "投资人(股权)变更"
},
{
"changeAfter": "成都士兰半导体制造有限公司,实物,货币;",
"changeBefore": "成都士兰半导体制造有限公司;",
"changeDate": "2017-06-21 00:00:00",
"changeField": "股东或股份发起人改变姓名或名称变更"
},
{
"changeAfter": "15000",
"changeBefore": "成都士兰半导体制造有限公司;",
"changeDate": "2017-06-21 00:00:00",
"changeField": "出资额变更"
},
{
"changeAfter": "成都士兰半导体制造有限公司 出资 21000万人民币;",
"changeBefore": "成都士兰半导体制造有限公司 出资 18000万人民币;",
"changeDate": "2020-06-03 00:00:00",
"changeField": "出资情况"
},
{
"changeAfter": "4000",
"changeBefore": "500",
"changeDate": "2015-09-25 00:00:00",
"changeField": "注册资本(金)变更"
},
{
"changeAfter": "65000.000000万人民币",
"changeBefore": "52000万人民币",
"changeDate": "2021-11-08 00:00:00",
"changeField": "注册资本变更"
},
{
"changeAfter": "9000",
"changeBefore": "成都士兰半导体制造有限公司;",
"changeDate": "2015-12-25 00:00:00",
"changeField": "出资额变更"
},
{
"changeAfter": "21000.000000万人民币",
"changeBefore": "18000万人民币",
"changeDate": "2020-06-03 00:00:00",
"changeField": "注册资本变更"
},
{
"changeAfter": "/",
"changeBefore": "/",
"changeDate": "2017-03-21 00:00:00",
"changeField": "其他事项备案"
},
{
"changeAfter": "15000",
"changeBefore": "9000",
"changeDate": "2017-06-21 00:00:00",
"changeField": "注册资本(金)变更"
},
{
"changeAfter": "9000",
"changeBefore": "成都士兰半导体制造有限公司;",
"changeDate": "2015-12-25 00:00:00",
"changeField": "股东或股份发起人改变姓名或名称变更"
},
{
"changeAfter": "15000",
"changeBefore": "9000",
"changeDate": "2017-06-21 00:00:00",
"changeField": "其他事项备案"
},
{
"changeAfter": "成都士兰半导体制造有限公司 出资 65000万人民币;",
"changeBefore": "成都士兰半导体制造有限公司 出资 52000万人民币;",
"changeDate": "2021-11-08 00:00:00",
"changeField": "投资人(股权)变更"
},
{
"changeAfter": "31000.000000万人民币",
"changeBefore": "21000万人民币",
"changeDate": "2020-08-26 00:00:00",
"changeField": "注册资本变更"
},
{
"changeAfter": "9000",
"changeBefore": "4000",
"changeDate": "2015-12-24 00:00:00",
"changeField": "其他事项备案"
},
{
"changeAfter": "成都士兰半导体制造有限公司,货币;",
"changeBefore": "成都士兰半导体制造有限公司;",
"changeDate": "2015-09-25 00:00:00",
"changeField": "股东或股份发起人改变姓名或名称变更"
},
{
"changeAfter": "4000",
"changeBefore": "成都士兰半导体制造有限公司;",
"changeDate": "2015-09-25 00:00:00",
"changeField": "股东或股份发起人改变姓名或名称变更"
},
{
"changeAfter": "52000.000000万人民币",
"changeBefore": "40000万人民币",
"changeDate": "2021-03-30 00:00:00",
"changeField": "注册资本变更"
},
{
"changeAfter": "21000.000000万人民币",
"changeBefore": "18000万人民币",
"changeDate": "2020-06-03 00:00:00",
"changeField": "注册资本(金)变更"
},
{
"changeAfter": "成都士兰半导体制造有限公司,实物,货币;",
"changeBefore": "成都士兰半导体制造有限公司;",
"changeDate": "2015-12-24 00:00:00",
"changeField": "股东或股份发起人改变姓名或名称变更"
},
{
"changeAfter": "成都士兰半导体制造有限公司 出资 52000万人民币;",
"changeBefore": "成都士兰半导体制造有限公司 出资 40000万人民币;",
"changeDate": "2021-03-30 00:00:00",
"changeField": "投资人(股权)变更"
},
{
"changeAfter": "成都士兰半导体制造有限公司,实物,货币;",
"changeBefore": "成都士兰半导体制造有限公司;",
"changeDate": "2017-06-21 00:00:00",
"changeField": "出资方式变更"
},
{
"changeAfter": "成都士兰半导体制造有限公司 出资 21000万人民币;",
"changeBefore": "成都士兰半导体制造有限公司 出资 18000万人民币;",
"changeDate": "2020-06-03 00:00:00",
"changeField": "投资人(股权)变更"
},
{
"changeAfter": "集成电路、半导体分立器件、功率模块等半导体产品的设计、制造、销售及相关技术转让;相关的原材料、机械设备的销售;货物进出口和技术进出口。(依法需批准的项目,经相关部门批准后方可开展经营活动)。",
"changeBefore": "集成电路、半导体分立器件、功率模块等半导体产品的设计、制造、销售;货物进出口。(依法需批准的项目,经相关部门批准后方可开展经营活动)。",
"changeDate": "2017-10-23 00:00:00",
"changeField": "投资人(股权)变更"
},
{
"changeAfter": "18000",
"changeBefore": "15000",
"changeDate": "2018-10-11 00:00:00",
"changeField": "其他事项备案"
},
{
"changeAfter": "集成电路、半导体分立器件、功率模块等半导体产品的设计、制造、销售及相关技术转让;相关的原材料、机械设备的销售;货物进出口和技术进出口。(依法需批准的项目,经相关部门批准后方可开展经营活动)。",
"changeBefore": "集成电路、半导体分立器件、功率模块等半导体产品的设计、制造、销售;货物进出口。(依法需批准的项目,经相关部门批准后方可开展经营活动)。",
"changeDate": "2017-10-23 00:00:00",
"changeField": "经营范围变更"
},
{
"changeAfter": "4000",
"changeBefore": "500",
"changeDate": "2015-09-25 00:00:00",
"changeField": "其他事项备案"
}
],
"contactInfo": {
"email": "497837510@qq.com",
"phoneNumber": "028-84925100",
"website": [
{
"name": "成都集佳科技有限公司",
"url": "www.perfect-cd.com"
}
]
},
"employees": [
{
"employeeName": "李学敏",
"position": "总经理"
},
{
"employeeName": "范伟宏",
"position": "执行董事"
},
{
"employeeName": "陈国华",
"position": "监事"
}
],
"exceptions": [],
"industry": {
"industryL1Name": "制造业",
"industryL2Name": "电气机械和器材制造业"
},
"liquidation": null,
"mPledges": [
{
"debtSecuredAmount": "4000万人民币",
"publicDate": null,
"registerDate": "2019-07-17 00:00:00",
"registerNo": "51012019003620",
"registerOffice": "四川省成都市金堂县市场和质量监督管理局",
"status": "有效"
}
],
"originalName": [],
"partners": [
{
"capiDate": null,
"investName": null,
"investType": "货币,实物",
"shoudDate": "2021-03-31 00:00:00,2021-12-31 00:00:00",
"stockCapital": "65000.0",
"stockName": "成都士兰半导体制造有限公司",
"stockPercent": "1.0000",
"stockRealcapital": null,
"stockType": "企业法人"
}
],
"pledges": [],
"punishes": [],
"shiXinItems": [],
"spotChecks": [],
"taxCreditltems": [
{
"level": "A",
"taxPayerName": "成都集佳科技有限公司",
"taxPayerNo": "9151012134303590X1",
"year": "2019"
},
{
"level": "A",
"taxPayerName": "成都集佳科技有限公司",
"taxPayerNo": "9151012134303590X1",
"year": "2020"
}
],
"zhiXingItems": []
}
}